Abstracts submission is open!

Abstracts submission is open!

ISWA World Congress 2019 opens the period to receive abstracts relating to Sustainable Cities, Technologies in Waste Management, Digital Innovation, Climate Change and WM, Social Innovation and Marine Litter. With this initiative, the industry’s leading solid waste management event invites proffesionals to form part of its program and tell their experience before 1,500 skilled attendees from the sector. The proposals will be received up until 12 February.

To formalize the application, you just need to signin in the Authors’ Area and send your abstract(s) before 12 February. After that date, representatives of the organization will be in contact with the authors of the abstracts selected for inclusion in the programme of ISWA World Congress, whose 29th edition will take place on 7, 8 and 9 October, 2019, in the Euskalduna Palace in Bilbao.

2 Comments
  1. Buenos dias

    Soy profesora investigadora en temas de agua y agua potable. Trabajo como profesora en la Universidad del Norte, con sede en Barranquila, una ciudad del Caribe colombiano. Tengo mucho deseos de compartir un tema de mis investigaciones en el congreso ISWA 2019.

    Mil gracias
    Judith Echeverria

  2. Dear Drs / Madam
    For this event I would like present our new company GREENVAL TECHNOLOGIES who is a company with a patent rights of a pyrolysis technology (with CSIC) to process tires, plastics and other waste products. We have develop, manufacture and commissioning a Plant in Zaragoza that process 6000 Tn of shredded tires to produce Fuel and Black Carbon. The plant is working on. On the other hand we have been selected with a SME H2020 Phase I by CE with a project named PYROCRACK. This technology we have already with a TRL5 plant and process Urban Waste in order to obtain energy and Carbon, always with a lettle and medium size plants but high efficient and with a reduced emissions.
    I will prepare an abstract but with this message, please, take it for granted the sign of GREENVAL in the Author’s Area.
    Regards

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